SO3P/LCC
Overview
Small Outline J-leaded (SOJ) packages are another version of SOIC with J-type leads, instead of gull-wing leads.
Plastic Leaded Chip Carrier (PLCC) packages utilize J-lead with pin spacings of 0.05” and lead forming is wrapped around and under the edge of the package, resembling the letter J in cross section.
Greatek offers limited pin counts from SOJ and PLCC packages, developed to fulfill customer’s request, specializing in flash memory, MCU, and S-RAM products.
Feature
- Au wire diameter from 0.8mil to 1.3mil.
- Cu wire diameter available from 0.8mil to 1.2mil.
- Green PKG & ROHS REACH compliance.
- Pure matte tin plating.
- Multi-die and stack die assembly available.
Packing method
Tube packing available.
Reliability Qualification
| Moisture Sensitivity Level | JEDEC MSL3 (30°C / 60% RH / 192hrs) |
| Temp. Cycle Test | -65/+150°C, 500 cycles |
| Pressure Cooker Test | 121°C, 100% RH, 2 atm, 168hrs |
| High Temp. Storage Test | 150°C, 500hrs |