QFN DFN
Overview
QFN (Quad Flat No-leads) package is a type of surface-mount technology (SMT) package used to house integrated circuits (ICs). It is characterized by its small size, thin profile, and ‘no leads’ design, with terminal pads located on the bottom of the package.
Greatek offers a complete line of QFN and DFN products, with package sizes from 1×1 to 14X14mm, developed to fulfill customers’ requests.
Feature
- Au wire diameter from 0.7mil to 2.0mil
- Cu wire diameter available from 0.7mil to 2.0mil
- Package thickness: 0.35,0.45, 0.55, 0.75, 0.85 mm
- Body size available from 1x1mm to 14x14mm
- Chip on lead (COL) QFN are available.
- Dual row QFN are available.
- Pure matte tin plating and PPF are available
- Multi-die and stack die assembly are available
- Same die stacked FOW (Film on wire) are available.
- Wettable flank QFN are available.
- Full in-house package and leadframe design capability
- Full in-house assembly and test capability
- Full in-house electrical, thermal and mechanical simulation and measurement capability
- Wide range of open tool leadframe and die pad sizes available
Packing method
JEDEC Tray / Tape & Reel available.
Reliability Qualification
| Body Sizes(mm) | 3×3 to 10×10 with square or rectangular body size options; |
| Ball Count | 200 to 500 |
| Ball Pitch (mm) | 0.4 to 0.65 |
| Typ. Pkg. Thickness | FCCSP: 1.00mm max FCCSP : 0.90mm max. FCLGA : 0.68mm max. |