Assembly Service in Greatek
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Assembly Service Overview
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Package Family
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Assembly Process Capability
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Assembly Service Overview
Greatek Electronic Inc. provides completed the cost-effective and high-performed assembly service and time-to-market for IC packaging. Greatek offers a full suite of assembly solutions to meet customer’s IC packaging needs, from standard plastic, advanced stacked die, and multi-chip assembly.
Package Families
- Plastic Dual-inline Package Family:
P-DIP, Skinny P-DIP, Shrink P-DIP. - Small Outline Package Family:
SOP, SSOP, TSSOP, TSOP, MSOP, SOJ - Quad Flat Package Family:
QFP, LQFP, TQFP, PLCC - TO, SOT
- Quad Flat Package Family
- Customer Package:
LGA, Pre-mold Package, Transparent Package.
Assembly Process Capability
| Wafer Back Grinding | 12” / 8” / 6” wafer |
| Wafer Dicing | 12” / 8” / 6” wafer |
| Die Attach | Paste / DAF / WBC / Hi-thermal |
| Flip Chip Bond | Cu Pillar |
| Wire Bond | Au / Cu / Ag / 0.7 mil ~ 2.0 mil |
| Encapsulation | Package Thickness 0.50mm up / transparent m/c |
| Marking | Laser and Printing |
| Trimming & Forming | Lead Pitch 0.40mm up |
| Singulation | Package Size 1.0×1.0 up |
| Tape Reel | Package Size 1.0×1.0 up |
New Technology Package
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Copper wire bonding
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Ag alloy wire bonding
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FOW wire bonding.
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Thin Package Encapsulation
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Stacked Die (Two Die)
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