Flip Chip QFN/DFN/SOP/TSOT
Overview
FC-QFN (Flip-Chip Quad Flat No lead) is a molded package using flip chip interconnections on a copper lead frame. This package provides small form factor compared with conventional QFP packages. And it also provides better electrical performance due to the short electrical path.
Greatek offers a complete flip chip line of QFN/DFN/SOP/TSOT products, QFN/DFN package sizes from 1×1 to 6X6mm, developed to fulfill customers’ requests.
Feature
- Same package with up to 2X larger die.
- Improvement in self-inductance and capacitance.
- lower thermal resistance.
- Reduction in resistance vs wire bond.
- QFN/DFN MSL1 is capable.
- Green PKG & ROHS REACH compliance.
- Pure matte tin plating are available.
- Only support copper pillar bump (C2).
- QFN/DFN PKG thickness: 0.35,0.45, 0.55, 0.75, 0.85 mm.
- Full in-house package and bumping layout design capability.
- Full in-house assembly and test capability.
- Full in-house electrical, thermal and mechanical simulation and measurement capability.
- Wide range of open tool leadframe and die pad sizes available.
Packing method
JEDEC Tray / Tape & Reel available.
Reliability Qualification
| Moisture Sensitivity Level | JEDEC MSL3 (30°C / 60% RH / 192hrs) |
| Temp. Cycle Test | -65/+150°C, 500 cycles |
| Pressure Cooker Test | 121°C, 100% RH, 2 atm, 168hrs |
| High Temp. Storage Test | 150°C, 500hrs |