Small-outline Package (SOP or SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent DIP, with a typical thickness that is 70% less.

Greatek specializes in SOP assembly and offers not only in narrow body, but also expanded to wide body SOIC, mini-SOP, Shrink Small-outline Package (SSOP), and Thin Shrink Small-outline Package (TSSOP). We have a full complete assembly line up with large assembly & test capacity in SOIC group.
Our expertise can also be expanded to related pin counts sharing SOIC tooling/equipment.